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Silicone Heat Transfer Compound 150g

Item#: 860-150G

Individual Product Details:

Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.

High thermal conductivity
High dielectric constant
High dissipation factor
Use with heat sinks or metal chassis
Will not dry or harden
Contains zincs oxides and polydimenthyl siloxane
Meets MIL-DTL-47113D

Specifications

Physical Properties	Test Method	Silicone 860
Appearance	Visual	White paste
Consistency	ASTM D 217
Specific Gravity @ 25°C (77°F)		2.3 min
Bleed % 24 hours @ 200°C	FTM-321	2.0% max
Evaporation 24 hours @ 200°C	FTM-321	2.0% max
Dropping Point	ASTM D-566	> 500°F (260°C)
Max. operating temp.		200°C (consistent) 300°C intermittent
Electrical Properties	Test Method	Silicone 860
Thermal Conductivity	Hot Wire Method Heat Flow #36 °C	0.657 W/m•K
Dielectric Strength (0.05l gap)	ASTM D-149	400 V/MIL
Dielectric Constant @ 1000 Hz	ASTM D- 150	3.81
Dissipation Factor @ 1000 Hz	ASTM D 150	0.0032
Resistivity @ 21°C	ASTM D 150	1.5 x 10¹⁵ Ohm/cm