.032" 21 Guage 1lb SN99 Lead Free Solder - No Clean
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Overview
.032" 21 Guage 1lb SN99 Lead Free Solder - No Clean
99.3% tin and 0.7% copper
M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Cu (Tin/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would use normal solder.
Features / Benefits
Lead free
Complies with RoHS
Exceeds the impurity requirements of J-Std-006
No Clean flux
21 Gauge, 0.032" diameters
Excellent wettability
Hard non-conductive residues
Flux Percentage
M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is 2.0-4.0%.
Flux Core
A unique flux system was specifically used for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator that wets and spreads like an RA type. This special activator exhibits virtually no spattering. Activator conforms to J-STD-004, REL0. Cleaning Flux core is a no clean formulation therefore the residues do not need to be removed for typical applications. If residue removal is desired, use Flux Removers: 413B-425G or 4140-400G.
Specifications:
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Std. Wire Gauge 