Silicone Heat Transfer Compound 150g

Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.

High thermal conductivity
High dielectric constant
High dissipation factor
Use with heat sinks or metal chassis
Will not dry or harden
Contains zincs oxides and polydimenthyl siloxane
Meets MIL-DTL-47113D

Specifications:

Physical Properties: Test Method / Silicone 860

Appearance: Visual / White paste
Consistency: ASTM D 217
Specific Gravity @ 25°C (77°F): 2.3 min
Bleed % 24 hours @ 200°C: FTM-321 / 2.0% max
Evaporation 24 hours @ 200°C: FTM-321 / 2.0% max
Dropping Point: ASTM D-566 / > 500F (260°C)
Max. operating temp.: 200°C (consistent) - 300°C intermittent

Electrical Properties: Test Method / Silicone 860

Thermal Conductivity: Hot Wire Method Heat Flow #36 °C / 0.657 W/m•K
Dielectric Strength (0.05l gap): ASTM D-149 / 400 V/MIL
Dielectric Constant @ 1000 Hz: ASTM D-150 / 3.81
Dissipation Factor @ 1000 Hz: ASTM D-150 / 0.0032
Resistivity @ 21°C: ASTM D-150 / 1.5 x 10¹⁵ Ohm/cm

Material Safety Data Sheet (MSDS Sheet)

MG Chemicals RoHS Statement