
CSI-PREMIER-PRO Rework & Soldering Station
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CSI-PREMIER-PRO Rework & Soldering Station
Especially suitable for de-soldering and soldering of various small components of mobile phone motherboards, such as SOIC, CHIP, QFP, PLCC, BGA, SMD and other small package components. Can also be used for heat shrinking, drying, paint removal de bonding, thawing, preheating, glue welding, etc.
Features:
- Selectable temperature display of Celsius/Fahrenheit
- Auto heat shut off when handle is returned to the stand.
- Sleep function turns the heating element off when unattended.
- Anti-static design to prevent static damage to components.
Specifications:
Input Voltage: | 110-127V AC 60Hz |
Power consumption: | 750W |
Dimensions | L 148mm x L 99mm H 134mm |
Weight | 2.88kg |
Working environment | 32~104°F (0°C~40°C) |
Storage environment | -4~176°F (-20~80°C) |
Storage humidity | 35%~45% |
Hot Air Gun | |
Airflow type: | Brushless fan |
Airflow: | ≤120L/min |
Temperature range: | 212°F~896°F (100°C~480°C) |
Display | Digital display |
Handle cord length | ≥100cm |
Noise | ≤45dB |
Soldering iron | |
Rated Power | 60 Watt |
Temperature range: | 392°F~896°F (200°C~480°C) |
Output voltage | 24VAC |
Display | Digital Display |
Handle cord length | ≥100cm |